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INTEGRATED CIRCUITS
74ALVCH162827 20-bit buffer/line driver, non-inverting, with 30W termination resistors (3-State)
Product specification IC24 Data Handbook 1998 Sep 29
Philips Semiconductors
Philips Semiconductors
Product specification
20-bit buffer/line driver, non-inverting, with 30 termination resistors (3-State)
74ALVCH162827
FEATURES
* Complies with JEDEC standard no. 8-1A. * CMOS low power consumption * Direct interface with TTL levels * Current drive 12 mA at 3.0 V * MULTIBYTETM flow-through standard pin-out architecture * Low inductance multiple VCC and GND pins for minimum noise
and ground bounce
DESCRIPTION
The 74ALVCH162827 high-performance CMOS device combines low static and dynamic power dissipation with high speed and high output drive. The 74ALVCH162827 20-bit buffers provide high performance bus interface buffering for wide data/address paths or buses carrying parity. They have NAND Output Enables (nOE1, nOE2) for maximum control flexibility. The 74ALVCH162827 is designed with 30 series resistance in both the pull-up and pull-down output structures. This design reduces line noise in applications such as memory address drivers, clock drivers and bus receivers/transmitters. To ensure the high impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
* Integrated 30 W termination resistors
QUICK REFERENCE DATA
GND = 0V; Tamb = 25C; tr = tf = 2.5ns SYMBOL PARAMETER Propagation delay tPHL/tPLH nAn to nYn CI Input capacitance CPD Power dissipation capacitance per latch dissi ation ca acitance er CONDITIONS VCC = 2.5V, CL = 30pF VCC = 3.3V, CL = 50pF
1
VI = GND to VCC
Output enabled Output disabled
TYPICAL 2.9 2.9 5 14 3
UNIT ns pF pF F
NOTES: 1. CPD is used to determine the dynamic power dissipation (PD in mW): PD = CPD x VCC2 x fi + S (CL x VCC2 x fo) where: fi = input frequency in MHz; CL = output load capacity in pF; fo = output frequency in MHz; VCC = supply voltage in V; S (CL x VCC2 x fo) = sum of outputs.
ORDERING INFORMATION
PACKAGES 56-Pin Plastic TSSOP Type II TEMPERATURE RANGE -40C to +85C OUTSIDE NORTH AMERICA 74ALVCH162827DGG NORTH AMERICA ACH162827DGG DWG NUMBER SOT364-1
PIN DESCRIPTION
PIN NUMBER 55, 54, 52, 51, 49, 48, 47, 45, 44, 43, 42, 41, 40, 38, 37, 36, 34, 33, 31, 30 2, 3, 5, 6, 8, 9, 10, 12, 13, 14, 15, 16, 17, 19, 20, 21, 23, 24, 26, 27 1, 56, 28, 29 4, 11, 18, 25, 32, 39, 46, 53 7, 22, 35, 50 SYMBOL 1A0 - 1A9 2A0 - 2A9 1Y0 - 1Y9 2Y0 - 2Y9 1OE1 1OE2, 2OE1, 2OE2 GND VCC Data inputs Data outputs Output enable inputs (active-LOW) Ground (0V) Positive supply voltage FUNCTION
1998 Sep 29
2
853-2127 20100
Philips Semiconductors
Product specification
20-bit buffer/line driver, non-inverting, with 30 termination resistors (3-State)
74ALVCH162827
PIN CONFIGURATION
1OE1 1Y0 1Y1 GND 1Y2 1Y3 VCC 1Y4 1Y5 1Y6 GND 1Y7 1Y8 1Y9 2Y0 2Y1 2Y2 GND 2Y3 2Y4 2Y5 VCC 2Y6 2Y7 GND 2Y8 2Y9 2OE1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 1OE2 1A0 1A1 GND 1A2 1A3 VCC 1A4 1A5 1A6
LOGIC SYMBOL (IEEE/IEC)
1OE1 1OE2 1 56 & EN2 & EN1
2OE1 28 2OE2 29 55 54 52 51 49 48 47 45 44 43 42 41 40 38 37 36 34 33 31 30
1A0 1A1 1A2 1A3 1A4 1A5
1
1
2 3 5 6 8 9 10 12 13 14
1Y0 1Y1 1Y2 1Y3 1Y4 1Y5 1Y6 1Y7 1Y8 1Y9 2Y0 2Y1 2Y2 2Y3 2Y4 2Y5 2Y6 2Y7 2Y8 2Y9
GND 1A6 1A7 1A8 1A9 2A0 2A1 2A2 GND 2A3 2A4 2A5 VCC 2A6 2A7 GND 2A8 2A9 2OE2 1A7 1A8 1A9 2A0 2A1 2A2 2A3 2A4 2A5 2A6 2A7 2A8 2A9
1
2
15 16 17 19 20 21 23 24 26 27
SH00012
SH00010
LOGIC SYMBOL
55 54 52 51 49 48 47 45 44 43
FUNCTION TABLE
INPUTS nOE1 nOE2 L L X H nAn L H X X L L H
1Y7 1Y8 1Y9
OUTPUT nYn L H Z Z
OPERATING MODE Transparent Transparent High impedance High impedance
1A0 1A1 1A2 1A3 1A4 1A5 1A6 1 56 1OE1 1OE2 1Y0 1Y1 1Y2 1Y3 1Y4 1Y5 1Y6
1A7 1A8
1A9
X X Z H L = = = =
2 42
3 41
5 40
6 38
8 37
9 36
10 34
12 33
13 31
14 30
Don't care High impedance "off" state High voltage level Low voltage level
2A0 2A1 2A2 2A3 2A4 2A5 2A6 28 29 2OE1 2OE2 2Y0 2Y1 2Y2 2Y3 2Y4 2Y5 2Y6
2A7 2A8
2A9
2Y7 2Y8
2Y9
15
16
17
19
20
21
23
24
26
27
SH00011
1998 Sep 29
3
Philips Semiconductors
Product specification
20-bit buffer/line driver, non-inverting, with 30 termination resistors (3-State)
74ALVCH162827
LOGIC DIAGRAM
nA0 nA1 nA2 nA3 nA4 nA5 nA6 nA7 nA8 nA9
nOE1 nOE2 nY0 nY1 nY2 nY3 nY4 nY5 nY6 nY7 nY8 nY9
SH00013
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER DC supply voltage 2.5V range (for max. speed performance @ 30 pF output load) VCC DC supply voltage 3.3V range (for max. speed performance @ 50 pF output load) DC Input voltage range DC output voltage range Operating free-air temperature range Input rise and fall times VCC = 2.3 to 3.0V VCC = 3.0 to 3.6V CONDITIONS MIN 2.3 3.0 0 0 -40 0 0 MAX 2.7 V 3.6 VCC VCC +85 20 10 V V C ns/V UNIT
VI VO Tamb tr, tf
ABSOLUTE MAXIMUM RATINGS
In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are referenced to GND (ground = 0V) SYMBOL VCC IIK VI IOK VO IO IGND, ICC Tstg PTOT PARAMETER DC supply voltage DC input diode current DC input voltage DC output diode current DC output voltage DC output source or sink current DC VCC or GND current Storage temperature range Power dissipation per package -plastic thin-medium-shrink (TSSOP) For temperature range: -40 to +125 C above +55C derate linearly with 8 mW/K VI t0 Note 1 VO uVCC or VO t 0 Note 1 VO = 0 to VCC CONDITIONS RATING -0.5 to +4.6 -50 -0.5 to +4.6 "50 -0.5 to VCC +0.5 "50 "100 -65 to +150 600 UNIT V mA V mA V mA mA C mW
NOTE: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 Sep 29
4
Philips Semiconductors
Product specification
20-bit buffer/line driver, non-inverting, with 30 termination resistors (3-State)
74ALVCH162827
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions. Voltage are referenced to GND (ground = 0 V). LIMITS SYMBOL PARAMETER TEST CONDITIONS Temp = -40C to +85C MIN VIH HIGH level Input voltage VCC = 2.3 to 2.7V VCC = 2.7 to 3.6V LOW level Input voltage VCC = 2.3 to 2.7V VCC = 2.7 to 3.6V VCC = 2 3 to 3 6V; VI = VIH or VIL; IO = -100A 100A 2.3 3.6V; VCC = 2.3V; VI = VIH or VIL; IO = -4mA VCC = 2.3V; VI = VIH or VIL; IO = -6mA VOH HIGH level output voltage VCC = 2.7V; VI = VIH or VIL; IO = -4mA VCC = 2.7V; VI = VIH or VIL; IO = -8mA VCC = 3.0V; VI = VIH or VIL; IO = -6mA VCC = 3.0V; VI = VIH or VIL; IO = -12mA VCC = 2 3 to 3 6V; VI = VIH or VIL; IO = 100A 2.3 3.6V; VCC = 2.3V; VI = VIH or VIL; IO = 4mA VCC = 2.3V; VI = VIH or VIL; IO = 6mA VOL LOW level output voltage VCC = 2.7V; VI = VIH or VIL; IO = 4mA VCC = 2.7V; VI = VIH or VIL; IO = 8mA VCC = 3.0V; VI = VIH or VIL; IO = 6mA VCC = 3.0V; VI = VIH or VIL; IO = 12mA II IOZ ICC ICC IBHL IBHH IBHLO IBHHO g Input leakage current 3-State output OFF-state current Quiescent supply current Additional quiescent supply current Bus hold LOW sustaining current Bus hold HIGH sustaining current Bus hold LOW overdrive current Bus hold HIGH overdrive current VCC = 2 3 to 3 6V; 2.3 3.6V; VI = VCC or GND VCC = 2.3 to 3.6V; VI = VIH or VIL; VO = VCC or GND VCC = 2.3 to 3.6V; VI = VCC or GND; IO = 0 VCC = 2.3V to 3.6V; VI = VCC - 0.6V; IO = 0 VCC = 2.3V; VI = 0.7V2 45 -45 -75 500 -500 -175 VCC*0.2 02 VCC*0.4 VCC*0.6 VCC*0.5 VCC*0.7 VCC*0.6 VCC*1.0 1.7 2.0 TYP1 1.2 V 1.5 1.2 1.5 VCC VCC*0.11 VCC*0.17 VCC*0.09 VCC*0.19 VCC*0.13 VCC*0.27 GND 0.07 0.11 0.06 0.13 0.09 0.19 0.1 0.1 0.2 150 - 0.20 0 20 0.40 0.55 0.40 0.60 0.55 0.80 5 10 40 750 A A A A A A A A V V 0.7 V 0.8 MAX UNIT
VIL
VCC = 2.3V; VI = 1.7V2 VCC = 3.0V; VI = 2.0V2 VCC = 3.6V2 VCC = 3.6V2
NOTES: 1. All typical values are at Tamb = 25C. 2. Valid for data inputs of bus hold parts.
1998 Sep 29
5
Philips Semiconductors
Product specification
20-bit buffer/line driver, non-inverting, with 30 termination resistors (3-State)
AC CHARACTERISTICS FOR VCC = 2.5V 0.2V
GND = 0V; tr = tf 2.0ns; CL = 30pF SYMBOL
74ALVCH162827
LIMITS PARAMETER Propagation delay nAn to nYn 3-State output enable time nOEn to nYn 3-State output disable time nOEn to nYn WAVEFORM MIN tPHL/tPLH tPZH/tPZL tPHZ/tPLZ 1, 3 2, 3 2,3 1.0 1.4 1.7 VCC = 2.5 0.2V TYP1 2.9 3.9 2.2 MAX 4.6 6.4 5.9 ns ns ns UNIT
NOTE: 1. All typical values are at VCC = 2.5V and Tamb = 25C.
AC CHARACTERISTICS FOR VCC = 3.0V 0.3V
GND = 0V; tr = tf 2.5ns; CL = 50pF SYMBOL LIMITS PARAMETER Propagation delay nAn to nYn 3-State output enable time nOEn to nYn 3-State output disable time nOEn to nYn WAVEFORM MIN tPHL/tPLH tPZH/tPZL tPHZ/tPLZ 1, 3 2, 3 2, 3 1.5 1.6 1.8 VCC = 3.3 0.3V TYP1, 2 2.9 3.7 3.0 MAX 4.2 5.4 4.7 LIMITS VCC = 2.7V TYP1 3.1 4.4 3.2 MAX 4.7 6.5 5.2 ns ns ns UNIT
NOTES: 1. All typical values are at VCC Tamb = 25C. 2. Typical value is measured at VCC = 3.3V.
1998 Sep 29
6
Philips Semiconductors
Product specification
20-bit buffer/line driver, non-inverting, with 30 termination resistors (3-State)
74ALVCH162827
AC WAVEFORMS FOR VCC = 2.3V TO 2.7V
VM = 0.5 VCC VX = VOL + 0.15V VY = VOH -0.15V VOL and VOH are the typical output voltage drop that occur with the output load. V =V CC I
TEST CIRCUIT AND WAVEFORM
VCC S1 2 * VCC Open GND
VI PULSE GENERATOR RT D.U.T.
VO
RL = 500
AC WAVEFORMS FOR VCC = 3.0V TO 3.6V AND VCC = 2.7V RANGE
VM = 1.5 V VX = VOL + 0.3V VY = VOH -0.3V VOL and VOH are the typical output voltage drop that occur with the output load. V = 2.7V I
VI An INPUT GND tPHL VOH tPLH
CL
RL = 500
Test Circuit for switching times DEFINITIONS
RL = Load resistor CL = Load capacitance includes jig and probe capacitance RT = Termination resistance should be equal to ZOUT of pulse generators.
SWITCH POSITION
VM TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH S1 Open 2 < VCC
GND
VCC < 2.7V 2.7-3.6V
VI VCC 2.7V
Yn OUTPUT VOL
VM
SV00906
Waveform 3. Load circuitry for switching times
SH00132
Waveform 1. Input (nAx) to Output (nYx) Propagation Delays
VI nOE INPUT GND VM
tPLZ VCC OUTPUT LOW-to-OFF OFF-to-LOW VX VOL tPHZ VOH OUTPUT HIGH-to-OFF OFF-to-HIGH GND outputs enabled outputs disabled VY
tPZL
VM
tPZH
VM
outputs enabled
SH00137
Waveform 2. 3-State Output Enable and Disable Times
1998 Sep 29
7
Philips Semiconductors
Product specification
20-bit buffer/line driver, non-inverting, with 30W termination resistors (3-State)
74ALVCH162827
TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1mm
SOT364-1
1998 Sep 29
8
Philips Semiconductors
Product specification
20-bit buffer/line driver, non-inverting, with 30W termination resistors (3-State)
74ALVCH162827
NOTES
1998 Sep 29
9
Philips Semiconductors
Product specification
20-bit buffer/line driver, non-inverting, with 30W termination resistors (3-State)
74ALVCH162827
DEFINITIONS
Data Sheet Identification
Objective Specification
Product Status
Formative or in Design
Definition
This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product.
Preliminary Specification
Preproduction Product
Product Specification
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088-3409 Telephone 800-234-7381 (c) Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Date of release: 06-98 Document order number: 9397-750-04603
Philips Semiconductors
1998 Sep 29 10

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